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Demand for advanced automotive semiconductors is on the rise due to the growth of electric vehicle technologies. To meet this demand, a team of researchers from Korea’s Korea Institute of Machinery and Materials (KIMM) has developed a machine that uses laser and waterjet technology to process crucial parts of these semiconductors. Cnc Laser Engraver

Led by researcher Sanghoon Ahn, the team created a laser-waterjet machine that can effectively process tough materials, such as silicon carbide (SiC). SiC is an important material for automotive semiconductors, but its processing requires specialized machines that were imported in the past. This new machine, however, can handle SiC efficiently, making it easier to cut and process.
One significant achievement of the team was the development of a 200W green nanosecond laser, previously only available through imports. They also improved the laser’s focusing ability, making it nine times more accurate than before. The machine’s design allows for a smooth flow of water, with the laser directed through this flow to create a precise cutting process at various points along the water stream.
This laser-waterjet machine combines the speed of typical laser machines with the precision of ultrafast lasers, making it highly efficient. Additionally, it collects fine dust and smoke produced during processing, keeping the work area clean. Importantly, this machine is also more affordable, costing 20% less than imported machines.

Laserpecker 2 Super Laser Engraver&Laser Cutter The development of this laser-waterjet machine helps strengthen Korea’s future semiconductor equipment industry and reinforces the competitiveness of the semiconductor industry as a whole. It also supports Korean corporations’ efforts to expand their market share. This research study was implemented with the support of the Ministry of Trade, Industry and Energy’s project on the development of laser hybrid machines for difficult-to-cut materials.